首页|Patent Application Titled 'Forming Films With Improved Film Quality' Published Online (USPTO 20240038527)
Patent Application Titled 'Forming Films With Improved Film Quality' Published Online (USPTO 20240038527)
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According to news reporting originating from Washington, D.C., by NewsRx journalists, a patent application by the inventors Citla, Bhargav S. (Fremont, CA, US); Modi, Purvam (Sunnyvale, CA, US); Nemani, Srinivas D. (Saratoga, CA, US); Yieh, Ellie Y. (San Jose, CA, US), filed on July 26, 2022, was made available online on February 1, 2024. No assignee for this patent application has been made. Reporters obtained the following quote from the background information supplied by the inventors: “An electronic device manufacturing system may include one or more process chambers in which substrates are processed to fabricate thereon electronic devices (e.g., integrated circuits and/or flatpanel displays). The process chambers may be operated at a vacuum level (e.g., ranging from about 0.01 Torr to about 80 Torr) and at high temperatures (e.g., ranging from about 100° C. to about 700° C.). A same or different substrate process may take place in each process chamber of the electronic device manufacturing system. Substrate processing may also occur in a load lock of some electronic device manufacturing systems. A load lock is a chamber through which substrates are transferred between process chambers and a factory interface for transport elsewhere in an electronic device manufacturing system.”
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