首页|'Ai Module' in Patent Application Approval Process (USPTO 20240038726)
'Ai Module' in Patent Application Approval Process (USPTO 20240038726)
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2024 FEB 20 (NewsRx) – By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News – A patent application by the inventors GOMYO, Hiroyuki (Kyoto, JP); KABE, Tatsuya (Osaka, JP); MITSUHASHI, Masatomo (Osaka, JP); NAKAGAWA, Masamichi (Osaka, JP); OBATA, Koji (Osaka, JP); SASAGO, Masaru (Osaka, JP); SONODA, Yutaka (Tokyo, JP), filed on December 21, 2021, was made available online on February 1, 2024, according to news reporting originating from Washington, D.C., by NewsRx correspondents. This patent application has not been assigned to a company or institution. The following quote was obtained by the news editors from the background information supplied by the inventors: “Patent Literature (PTL) 1 discloses a multi-layer semiconductor stack, which is a stack of multiple semiconductor dies that include functional units such as processor cores.”
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