Abstract
According to news reporting originating from Washington, D.C., by NewsRx journalists, a patent application by the inventors Cox, Damon K. (Jarrell, TX, US); Hudgens, Jeffrey C. (San Francisco, CA, US); Muthukamatchi, Karuppasamy (Madurai, IN), filed on October 19, 2023, was made available online on February 8, 2024. No assignee for this patent application has been made. Reporters obtained the following quote from the background information supplied by the inventors: "Electronic device manufacturing systems can include process tools having multiple chambers, such as process chambers and one or more load lock chambers. Such process chambers may be used to carry out any number of processes on substrates (e.g., silicon-containing wafers, both patterned and unpatterned, masked wafers, glass plates, silica-containing articles, and the like) such as deposition, oxidation, nitration, etching, diffusing, growing, implanting, polishing, cleaning, lithography, metrology, and the like. "Within such process tools, a plurality of such chambers may be distributed about a transfer chamber, for example. A robot may be at least partially contained within the transfer chamber and may be configured and adapted to transport substrates between the various chambers. For example, transfers may be between process chambers, or between process chambers and the one or more load lock chambers."
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