首页|"System And Method For Modeling A Semiconductor Fabrication Process" in Patent A pplication Approval Process (USPTO 20240086599)
"System And Method For Modeling A Semiconductor Fabrication Process" in Patent A pplication Approval Process (USPTO 20240086599)
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By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News-A patent application by the inventors Cha, Moonhyun (Yongin-si, KR); Jeong, Changwook (Hwaseong-si, KR); Kim, Hyunjoon g (Seoul, KR); Shin, Jaepil (Suwon-si, KR), filed on November 15, 2023, was made available online on March 14, 2024, according to news reporting originating fro m Washington, D.C., by NewsRx correspondents. This patent application has not been assigned to a company or institution. The following quote was obtained by the news editors from the background informa tion supplied by the inventors: "Embodiments of the inventive concept relate to a semiconductor process, and more particularly, to a system and method for model ing a semiconductor fabrication process. "An integrated circuit (IC) may include patterns formed in a plurality of layers , and the patterns may be formed using various processes included in a semicondu ctor process. The size of the patterns may be reduced to increase the integratio n density of the IC, and the complexity of the semiconductor fabrication process may be increased to form patterns with a reduced size. A pattern (i.e., a physi cal pattern) formed in the semiconductor process may have a different shape from a designed pattern due to various factors."
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