Abstract
News editors obtained the following quote from the background information suppli ed by the inventors: “Processing of substrates in semiconductor electronic devic e manufacturing may include a combination of different processes applied in the same substrate processing system. For example, the processes may include chemica l vapor deposition/atomic layer deposition (CVD/ALD) and physical vapor depositi on (PVD) applied within the same tool or platform. These processes may be applie d using different configurations of processing chambers coupled to a mainframe. Robots are located in a transfer chamber of the mainframe and are configured to move substrates between the various processing chambers.”
NETL
NSTL