首页|Researchers Submit Patent Application, 'Substrate Treating Apparatus', for Appro val (USPTO 20240066715)

Researchers Submit Patent Application, 'Substrate Treating Apparatus', for Appro val (USPTO 20240066715)

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No assignee for this patent application has been made. News editors obtained the following quote from the background information suppli ed by the inventors: “Such currently-used apparatus of this type include one hav ing a batch treatment unit, a single-wafer treatment unit, and a rotating mechan ism (see, for example, Japanese Patent Publication (Translation of PCT Applicati on) No. 2016-502275A). The batch treatment unit performs treatment on a pluralit y of substrates collectively. The single-wafer treatment unit performs treatment on substrates one by one.

Emerging TechnologiesMachine LearningPatent ApplicationRobotRobotics

2024

Robotics & Machine Learning Daily News

Robotics & Machine Learning Daily News

ISSN:
年,卷(期):2024.(Mar.18)