Abstract
No assignee for this patent application has been made.News editors obtained the following quote from the background information suppli ed by the inventors:“Examples of currently-used substrate treating apparatus in clude a substrate treating apparatus of ahybrid type provided with a batch-type processing module (batch processing unit) configured to performtreatment on a plurality of substrates collectively, and a single-wafer-type processing module (single-waferprocessing unit) configured to perform treatment on the substrates treated by the batch-type processingmodule one by one. See, for example, Japan ese Patent Publication (Translation of PCT Application) No.2016-502275 and Japa nese Unexamined Patent Publication No. 2021-064652.
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