首页|Patent Application Titled 'Loadlock Assembly Including Chiller Unit' Published O nline (USPTO 20240110282)
Patent Application Titled 'Loadlock Assembly Including Chiller Unit' Published O nline (USPTO 20240110282)
扫码查看
点击上方二维码区域，可以放大扫码查看
原文链接
NETL
NSTL
Reporters obtained the following quote from the background information supplied by the inventors:“Films may be fabricated on substrates using sequential steps including physical vapor deposition (PVD),chemical vapor deposition (CVD), atom ic layer deposition (ALD), etching, epitaxial growth, and annealingto produce a desired device. These steps may be carried out using a variety of processing sy stems havingmultiple chambers.
NETL
NSTL
