首页|New Machine Learning Findings from Beijing University of Chemical Technology Out lined (A Machine Learning and Finite Element Simulation-based Void Inspection fo r Higher Solder Joint Reliability)
New Machine Learning Findings from Beijing University of Chemical Technology Out lined (A Machine Learning and Finite Element Simulation-based Void Inspection fo r Higher Solder Joint Reliability)
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By a News Reporter-Staff News Editor at Robotics & Machine Learning DailyNews Daily News – Investigators publish new report on Ma chine Learning. According to news reporting out of Beijing, People’s Republic of China, by NewsRx editors, research stated, “We proposed a new approachfor high -quality void inspection to enhance solder joint reliability. Using a small batc h of samples, wedeveloped an automatic detection algorithm for voids in the Cu- Sn solder joint.”
BeijingPeople’s Republic of ChinaAsiaCyborgsEmerging TechnologiesMachine LearningBeijing University of Chemical Technology
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