首页|Patent Application Titled 'High Throughput Materials Screening' Published Online (USPTO 20240091808)

Patent Application Titled 'High Throughput Materials Screening' Published Online (USPTO 20240091808)

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No assignee for this patent application has been made.Reporters obtained the following quote from the background information supplied by the inventors: ““Field of Endeavor“The present application relates to materials screening and more particularly to high throughput materialsscreening.“State of Technology“This section provides background information related to the present disclosure which is not necessarilyprior art.

CyborgsEmerging TechnologiesMachine LearningPatent Application

2024

Robotics & Machine Learning Daily News

Robotics & Machine Learning Daily News

ISSN:
年,卷(期):2024.(Apr.5)