首页|'Substrate Treating Apparatus' in Patent Application Approval Process (USPTO 202 40096673)
'Substrate Treating Apparatus' in Patent Application Approval Process (USPTO 202 40096673)
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The following quote was obtained by the news editors from the background informa tion suppliedby the inventors: “Such currently-used types of devices include on e having a batch-type module anda single-wafer-type module. See, for example, P atent Literature 1. The batch-type module performs predetermined treatment on a plurality of substrates collectively. The single-wafer-type module performspred etermined treatment on substrates one by one. The batch-type module and the sing le-wafer-typemodule each have a unique merit. The substrate treating apparatus provided with the batch-type moduleand the single-wafer-type module possesses t he both merits, thereby obtaining a construction having abetter advantage than the batch-type substrate treating apparatus or the single-wafer substrate treati ngapparatus.
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NSTL
