Abstract
This patent application has not been assigned to a company or institution.The following quote was obtained by the news editors from the background informa tion supplied bythe inventors: ““Background and Relevant Art“As information technology equipment has changed, higher cooling capacity soluti ons are needed tosupport the computing power for Artificial Intelligence and Ma chine Learning applications. Air coolingrequires airflow to carry away thermal energy from the higher power chips, and a fan failure or blockagecan stop airfl ow to an entire row or rack of devices. Liquid cooled systems using cold plate t echnologycome with a potential failure in leaks causing hardware damage and uns afe working conditions. In bothinstances, a failure of even a part of the therm al management system can force a shutdown of one ormore parts of the datacenter , impacting processing and storage capabilities.”
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NSTL