首页|'Robot' in Patent Application Approval Process (USPTO 20240149435)
'Robot' in Patent Application Approval Process (USPTO 20240149435)
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The following quote was obtained by the news editors from the background informa tion supplied by the inventors: “ “The present disclosure relates to a robot. “A robot arm and a base section that supports the robot arm contains a device th at generates heat. Examples of such a device include a motor and a control subst rate. A cooling unit is desired to avoid degradation of performance of the devic e. “For example, JP-T-2022-521440 discloses a base section that supports a robot ar m. A robot system is disclosed that includes, as the base section, a bracket for ming a first thermal conduction path for dissipating heat from a heat generating part and a thermal pad forming a second thermal conduction path for dissipating heat from the heat generating part. Heat dissipation can be advantageously impr oved by the bracket and the thermal pad, because a plurality of thermal conducti on paths are formed.
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