首页|"Substrate Transfer Method" in Patent Application Approval Process (USPTO 202401 53807)
"Substrate Transfer Method" in Patent Application Approval Process (USPTO 202401 53807)
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By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News-A patent application by the inventors OKANO, Shinya (Yamanashi, JP); SHINODA, Nanako (Yamanashi, JP), filed on March 1 7, 2022, was made available online on May 9, 2024, according to news reporting o riginating from Washington, D.C., by NewsRx correspondents. This patent application has not been assigned to a company or institution. The following quote was obtained by the news editors from the background informa tion supplied by the inventors: "A substrate processing system, in which a subst rate is transferred from a processing chamber to a load lock chamber via a vacuu m transfer chamber by a transfer device provided in the vacuum transfer chamber and the substrate is transferred from the load lock chamber to a carrier attache d to a load port by a transfer device provided in an atmospheric transfer chambe r, is known, for example. "Patent Document 1 discloses a system configured to measure, when a wafer is tra nsferred from a first position to an intermediate position by an end effector of a first robot, a relative position between the wafer and the end effector, adju st a position at which an end effector of a second robot picks up the wafer from the intermediate position based on the measurement result, and transfer the waf er from the intermediate position to a second position by the end effector of th e second robot."
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