首页|Researchers Submit Patent Application, "Tip Calibration In An Additive Manufactu ring System", for Approval (USPTO 20240157650)
Researchers Submit Patent Application, "Tip Calibration In An Additive Manufactu ring System", for Approval (USPTO 20240157650)
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By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News-From Washington, D.C., NewsRx journali sts report that a patent application by the inventors Bosveld, Michael (Blooming ton, MN, US); Paul, Thomas Peter (Chanhassen, MN, US), filed on January 25, 2024 , was made available online on May 16, 2024. No assignee for this patent application has been made. News editors obtained the following quote from the background information suppli ed by the inventors: "The present disclosure relates to additive manufacturing s ystems for 3D printing of parts. In particular, the present disclosure relates t o systems and methods for print head tip calibration for print heads used in a 3 D printer. All references disclosed herein are incorporated by reference. "Additive manufacturing, also called 3D printing, is generally a process in whic h a three-dimensional (3D) part is built by adding material to form a 3D part ra ther than subtracting material as in traditional machining. Using one or more ad ditive manufacturing techniques, a three-dimensional part of virtually any shape can be printed from a digital model of the part by an additive manufacturing sy stem, commonly referred to as a 3D printer. A typical additive manufacturing wor k flow includes slicing a three-dimensional computer model into thin cross secti ons defining a series of layers, translating the result into two-dimensional pos ition data, and transmitting the data to a 3D printer which manufactures a three -dimensional structure in an additive build style. Additive manufacturing entail s many different approaches to the method of fabrication, including material ext rusion (e.g., fused deposition modeling, which may include continuous fiber depo sition), ink jetting, selective laser sintering, powder/binder jetting, electron -beam melting, electrophotographic imaging, and stereolithographic processes.
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