首页|Researchers Submit Patent Application, 'Substrate Processing Apparatus And Subst rate Processing Method', for Approval (USPTO 20240128111)
Researchers Submit Patent Application, 'Substrate Processing Apparatus And Subst rate Processing Method', for Approval (USPTO 20240128111)
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By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News – From Washington, D.C., NewsRx journali sts report that a patent application by the inventors AN, Byungin (Cheonan-si, K R); KIM, Tae Yong (Gunpo-si, KR), filed on September 29, 2023, was made availabl e online on April 18, 2024. No assignee for this patent application has been made. News editors obtained the following quote from the background information suppli ed by the inventors: “ “The present invention relates to a substrate processing apparatus and substrate processing method and, more particularly, to a substrate processing apparatus a nd substrate processing method capable of increasing utilization of equipment an d minimizing a footprint of the equipment because the function of a dual loader is performed with one load port module by using an embedded dual adaptor.
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