摘要
报告者从发明人提供的背景信息中获得了以下引述：“这里提供的背景描述是为了概括地呈现本公开内容的背景。本背景部分中描述的本发明人的工作，以及在提交时可能不符合现有技术的描述的方面，“衬底处理系统可用于对衬底例如半导体晶片进行沉积、蚀刻和/或其它处理。在处理期间，基板配置在基板处理系统的处理室中的基板支撑体上，将包含一种或多种前体的气体混合物导入处理室中，并撞击等离子体以激活化学反应。
Abstract
Reporters obtained the following quote from the background information supplied by the inventors: “The background description provided here is for the purpose o f generally presenting the context of the disclosure. Work of the presently name d inventors, to the extent it is described in this background section, as well a s aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art agains t the present disclosure. “A substrate processing system may be used to perform deposition, etching and/or other treatment of substrates such as semiconductor wafers. During processing, a substrate is arranged on a substrate support in a processing chamber of the su bstrate processing system. Gas mixtures including one or more precursors are int roduced into the processing chamber and plasma may be struck to activate chemica l reactions.
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NSTL