首页|'Robot For Handling Flat Substrates As Well As Alignment Facility' in Patent App lication Approval Process (USPTO 20240178045)
'Robot For Handling Flat Substrates As Well As Alignment Facility' in Patent App lication Approval Process (USPTO 20240178045)
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NSTL
The following quote was obtained by the news editors from the background informa tion supplied by the inventors: “In the semi-conductor industry robots are emplo yed for handling substrates, such as for example wafers. In particular, the robo ts enable transportation of one or more flat substrates which comprises taking u p the substrates before they are transported and depositing them after transport ation. The robots have a gripping facility with which the flat substrate(s) are taken up, transported, and deposited. Gripping facilities enabling the simultane ous handling of several flat substrates in technical language are also referred to as multiple-gripping facilities.
NETL
NSTL
