首页|'Substrate Attaching/Detaching Robot, Substrate Attaching/ Detaching Method, And Film Formation Apparatus' in Patent Application Approval Process (USPTO 20240173 852)
'Substrate Attaching/Detaching Robot, Substrate Attaching/ Detaching Method, And Film Formation Apparatus' in Patent Application Approval Process (USPTO 20240173 852)
扫码查看
点击上方二维码区域，可以放大扫码查看
原文链接
NETL
NSTL
By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News-A patent application by the inventor M ORI, Takayuki (Tokyo, JP), filed on November 9, 2023, was made available online on May 30, 2024, according to news reporting originating from Washington, D.C., by NewsRx correspondents. This patent application has not been assigned to a company or institution. The following quote was obtained by the news editors from the background informa tion supplied by the inventors: " "The present disclosure relates to a substrate attaching/detaching robot, a subs trate attaching/ detaching method, and a film formation apparatus. "Hitherto, a substrate attaching/detaching robot configured to attach or detach a substrate has been known. A substrate attaching/detaching method for attaching or detaching a substrate, and a film formation apparatus configured to perform film formation processes on a substrate have also been known (for example, see J apanese Laid-Open Patent Application Publication No. 2010-222700)."
NETL
NSTL
