首页|Researchers Submit Patent Application, 'Substrate Transfer Apparatus And Substra te Transfer Method', for Approval (USPTO 20240186175)

Researchers Submit Patent Application, 'Substrate Transfer Apparatus And Substra te Transfer Method', for Approval (USPTO 20240186175)

扫码查看
By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News-From Washington, D.C., NewsRx journali sts report that a patent application by the inventors KIMURA, Yoshiki (Fukuoka, JP); MINAMI, Takashi (Fukuoka, JP); SANEMASA, Hiroki (Fukuoka, JP), filed on Nov ember 15, 2023, was made available online on June 6, 2024. No assignee for this patent application has been made. News editors obtained the following quote from the background information suppli ed by the inventors: "Transfer apparatuses have been known in the related art, t ransferring substrates such as wafers and panels to and from a cassette that hol ds the substrates by using a robot with a hand. "For example, a technique has been proposed, which detects the possibility of co ntact between a robot and a wafer accommodated in a cassette by the sensor provi ded in a wafer transfer arm or a cassette (see, e.g., Japanese Patent Laid-Open Publication No. 2007-234936)."

Emerging TechnologiesMachine LearningPatent ApplicationRobotRobotics

2024

Robotics & Machine Learning Daily News

Robotics & Machine Learning Daily News

ISSN:
年,卷(期):2024.(Jun.20)