摘要
Robotics&Machine Learning Daily News Daily News的新闻记者兼新闻编辑-根据NewsRx记者从华盛顿特区发回的新闻报道，由Inve Ntors CHANG，Jung-hua（TW新竹县）；KUO，Ta-hao（TW新竹县）；LI N，Jing-cheng（TW新竹县）于2024本专利申请没有受让人。记者从发明人提供的背景信息中获得了以下引述：“技术领域”本发明公开了一种键合基板的分离方法，其能够自动地分离和传送键合基板，并且能够避免在传送过程中晶片的碎裂。
Abstract
By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News – According to news reporting originatin g from Washington, D.C., by NewsRx journalists, a patent application by the inve ntors CHANG, JUNG-HUA (Hsinchu County, TW); KUO, TA-HAO (Hsinchu County, TW); LI N, JING-CHENG (Hsinchu County, TW), filed on December 7, 2022, was made availabl e online on June 13, 2024. No assignee for this patent application has been made. Reporters obtained the following quote from the background information supplied by the inventors: “ “Technical Field “The disclosure is a separation method of a bonded substrate, which can automati cally separate and transmit the bonded substrate, and can avoid fragmentation of wafer during transmission.
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