首页|Patent Application Titled 'Separation Method Of Bonded Substrates' Published Onl ine (USPTO 20240194492)
Patent Application Titled 'Separation Method Of Bonded Substrates' Published Onl ine (USPTO 20240194492)
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By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News – According to news reporting originatin g from Washington, D.C., by NewsRx journalists, a patent application by the inve ntors CHANG, JUNG-HUA (Hsinchu County, TW); KUO, TA-HAO (Hsinchu County, TW); LI N, JING-CHENG (Hsinchu County, TW), filed on December 7, 2022, was made availabl e online on June 13, 2024. No assignee for this patent application has been made. Reporters obtained the following quote from the background information supplied by the inventors: “ “Technical Field “The disclosure is a separation method of a bonded substrate, which can automati cally separate and transmit the bonded substrate, and can avoid fragmentation of wafer during transmission.
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