首页|Patent Issued for Electrostatic substrate cleaning system and method (USPTO 1200 9227)
Patent Issued for Electrostatic substrate cleaning system and method (USPTO 1200 9227)
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By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News – According to news reporting originatin g from Alexandria, Virginia, by NewsRx journalists, a patent by the inventors Ma rk, Shai (Kibutz Snir, IL), Pahima, Adi (Migdal Ha’emek, IL), filed on May 3, 20 22, was published online on June 11, 2024. The assignee for this patent, patent number 12009227, is KLA Corporation (Milpit as, California, United States). Reporters obtained the following quote from the background information supplied by the inventors: “Silicon wafers are typically cleaned by either chemical solve nts or vibration techniques (e.g., ultra-sonic or mega-sonic cleaning). Chemical solvents can be dangerous to use and damaging to the wafer, and vibration techn iques often require large expensive tools. Additionally, both methods often resu lt in low throughput.As such, it would be advantageous to provide a system and method to remedy the shortcomings of the approaches identified above.”
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