摘要
Robotics&Machine Learning Daily News的新闻记者兼新闻编辑-根据NewsRx记者从弗吉尼亚州亚历山大市发回的新闻报道，发明者Ma Rk,Shai(Kibutz Snir,IL),Pahima,Adi(Migdal Ha'emek,IL)于20 22年5月3日提交的专利于2024年6月11日在网该专利的受让人是KLA Corporation(Milpit AS,California,United States)。记者从发明人提供的背景信息中获得了以下引述：“硅片通常通过化学溶解NTS或振动技术(例如超声波或超音速清洗)进行清洗。化学溶剂对使用和损坏硅片是危险的，振动技术通常需要昂贵的大型工具。此外，这两种方法通常都是低通量的，因此，提供一个系统和方法来弥补上述方法的缺点将是有利的。
Abstract
By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News – According to news reporting originatin g from Alexandria, Virginia, by NewsRx journalists, a patent by the inventors Ma rk, Shai (Kibutz Snir, IL), Pahima, Adi (Migdal Ha’emek, IL), filed on May 3, 20 22, was published online on June 11, 2024. The assignee for this patent, patent number 12009227, is KLA Corporation (Milpit as, California, United States). Reporters obtained the following quote from the background information supplied by the inventors: “Silicon wafers are typically cleaned by either chemical solve nts or vibration techniques (e.g., ultra-sonic or mega-sonic cleaning). Chemical solvents can be dangerous to use and damaging to the wafer, and vibration techn iques often require large expensive tools. Additionally, both methods often resu lt in low throughput.As such, it would be advantageous to provide a system and method to remedy the shortcomings of the approaches identified above.”
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