首页|Patent Application Titled 'Methods And Apparatus For Processing A Substrate' Pub lished Online (USPTO 20240170311)
Patent Application Titled 'Methods And Apparatus For Processing A Substrate' Pub lished Online (USPTO 20240170311)
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By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News – According to news reporting originatin g from Washington, D.C., by NewsRx journalists, a patent application by the inve ntors ANTONIO, Ralph P. (Santa Clara, CA, US); GONDHALEKAR, Sudhir R. (Fremont, CA, US); HUANG, Tzu-Fang (San Jose, CA, US); HUDGENS, Jeffrey (Santa Clara, CA, US); LAI, Peter (Santa Clara, CA, US); TAY, Lee Guan (Singapore, SG), filed on N ovember 18, 2022, was made available online on May 23, 2024. No assignee for this patent application has been made. Reporters obtained the following quote from the background information supplied by the inventors: “Integrated tools configured for substrate processing are know n. Typically, the integrated tool comprises one or more transfer robots (e.g., b uffer chamber robot) configured to transfer a substrate to/from one or more proc essing chambers of the integrated tool. In some instances, a user needs to manua lly perform substrate hand-off calibrations to ensure that the buffer chamber ro bot places the substrate to a center of a processing chamber substrate support ( e.g., a pedestal). Such an operation, however, requires specialized centering to ols, calibration substrates, and jigs and/or clear lids to ensure production sub strates don’t break and are properly placed in various processing chamber locati ons, which, in turn, requires the user to take down the integrated tool for a su bstantial amount of time (e.g., six (6) or more hours), which can result in a de crease of substrate throughput and a decrease in overall productivity. “Therefore, the inventors describe herein improved methods and apparatus that us e in-situ spatial recognition calibration systems.”
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