Reporters obtained the following quote from the background information supplied by the inventors: ““Technical Field“The present invention relates to a method for attaching modules such as instrum ent panels to avehicle body that has been transported to a prescribed position on a vehicle production line. “Background Information“A conventional module attachment method is described in, for example, Japanese Patent No. 5302797(hereinafter Patent Document 1). The method for attaching mod ules described in Patent Document 1 isa method for mounting an instrument panel in a vehicle cabin. The above-mentioned attachment methodmeasures the position s of a pair of left and right side vehicle body measurement reference sections i n thevehicle width direction at symmetrical positions in the vehicle, and also measures the positions of a pairof left and right instrument panel side measure ment reference sections in the vehicle width direction atsymmetrical positions in instrument panel before it is brought into the vehicle cabin.
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