首页|'Imprint Apparatus, Imprint Method, And Article Manufacturing Method' in Patent Application Approval Process (USPTO 20240210818)
'Imprint Apparatus, Imprint Method, And Article Manufacturing Method' in Patent Application Approval Process (USPTO 20240210818)
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The following quote was obtained by the news editors from the background informa tion supplied bythe inventors: ““Field of the Invention“The present invention relates to an imprint apparatus, an imprint method, and a n article manufacturingmethod.“Description of the Related Art“In the manufacture of an article such as a semiconductor, in order to improve t hroughput, two handscan be provided in a substrate conveyance robot that exchan ges a substrate with a substrate stage. Whilea substrate placed on the substrat e stage is processed, the substrate conveyance robot holding a substrateto be p rocessed next with one hand can wait at a substrate exchange position. When proc essing of thesubstrate placed on the substrate stage ends, the substrate convey ance robot can receive the substrateplaced on the substrate stage with the othe r hand, and place, on the substrate stage, the substrate heldwith the one hand of the substrate conveyance robot. If the waiting time of the substrate conveyan ce robotat the substrate exchange position varies between substrates, the influ ence of heat which the substratereceives at the substrate exchange position can change, so that the temperature of the substrate placed onthe substrate stage can vary. This can cause a variation in overlay accuracy. Japanese Patent Laid-O penNo. 2000-200820 describes a substrate conveyance apparatus provided with a t emperature adjustmentunit. However, providing a temperature adjustment unit in a substrate conveyance apparatus can lead toa complicated arrangement of the su bstrate conveyance apparatus.”
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