'Laser Dicing System For Filamenting And Singulating Optical Devices' in Patent Application Approval Process (USPTO 20240227081)
扫码查看
点击上方二维码区域，可以放大扫码查看
Abstract
This patent application has not been assigned to a company or institution.The following quote was obtained by the news editors from the background informa tion supplied bythe inventors: ““Field“Embodiments of the present disclosure generally relate to a laser dicing system for optical devices.“Description of the Related Art.
NETL
NSTL