首页|Patent Application Titled 'Equipment Automatic Alignment Method And Process Robo t Device Using The Same' Published Online (USPTO 20240260198)
Patent Application Titled 'Equipment Automatic Alignment Method And Process Robo t Device Using The Same' Published Online (USPTO 20240260198)
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Reporters obtained the following quote from the background information supplied by the inventors:“Semiconductor manufacturing process requires a variety of equ ipment to perform testing, solder filling,etching and other processes. In some equipment, an alignment process is required. For example, the testingpins of th e test equipment need to be aligned with the test pads. The solder outputting pi n of the solderfilling equipment needs to be aligned with the solder pads.
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