Abstract
The following quote was obtained by the news editors from the background informa tion supplied by theinventors: “Various manufacturing processes expose assemble d devices to high temperatures, a mixture ofcorrosive gases, high stress, and c ombinations thereof. For example, an assembled device may be exposedto an envir onment containing fluorine-, chlorine-, sulfur-, hydrogen-, bromine-, or nitroge n-based gases.Such gases may penetrate such an assembled device and condense on surfaces of internal components ofthe assembled device as acids. The acids may erode and/or corrode the internal and external componentsof assembled devices, increasing the devices’ susceptibility to defects.
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