首页|'Residual Thickness Compensation' in Patent Application Approval Process (USPTO 20240288838)
'Residual Thickness Compensation' in Patent Application Approval Process (USPTO 20240288838)
扫码查看
点击上方二维码区域，可以放大扫码查看
原文链接
NETL
NSTL
By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News – A patent application by the inventors Han, Xinhai (Palo Alto, CA, US); Liu, Albert (Fullerton, CA, US); Sanghvi, Mites h Harshad (Dublin, CA, US); Shankaramurthy, Venkatanarayana (San Jose, CA, US); Yao, Yulian (Santa Clara, CA, US), filed on February 23, 2023, was made availabl e online on August 29, 2024, according to news reporting originating from Washin gton, D.C., by NewsRx correspondents. This patent application has not been assigned to a company or institution. The following quote was obtained by the news editors from the background informa tion supplied by the inventors: “Products can be produced by performing one or m ore manufacturing processes using manufacturing equipment. For example, substrat e processing equipment can be used to produce substrates via substrate processin g operations.”
NETL
NSTL
