Robotics & Machine Learning Daily News2024,Issue(Sep.17) :111-113.

'Residual Thickness Compensation' in Patent Application Approval Process (USPTO 20240288838)

Robotics & Machine Learning Daily News2024,Issue(Sep.17) :111-113.

'Residual Thickness Compensation' in Patent Application Approval Process (USPTO 20240288838)

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Abstract

By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News – A patent application by the inventors Han, Xinhai (Palo Alto, CA, US); Liu, Albert (Fullerton, CA, US); Sanghvi, Mites h Harshad (Dublin, CA, US); Shankaramurthy, Venkatanarayana (San Jose, CA, US); Yao, Yulian (Santa Clara, CA, US), filed on February 23, 2023, was made availabl e online on August 29, 2024, according to news reporting originating from Washin gton, D.C., by NewsRx correspondents. This patent application has not been assigned to a company or institution. The following quote was obtained by the news editors from the background informa tion supplied by the inventors: “Products can be produced by performing one or m ore manufacturing processes using manufacturing equipment. For example, substrat e processing equipment can be used to produce substrates via substrate processin g operations.”

Key words

Cyborgs/Emerging Technologies/Machine Learning/Patent Application

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出版年

2024
Robotics & Machine Learning Daily News

Robotics & Machine Learning Daily News

ISSN:
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