首页|Researchers Submit Patent Application, 'Method Of Making High Aspect Ratio Openi ngs Using Multiple Cladding Masks And Apparatus For Implementing The Same', for Approval (USPTO 20240290622)
Researchers Submit Patent Application, 'Method Of Making High Aspect Ratio Openi ngs Using Multiple Cladding Masks And Apparatus For Implementing The Same', for Approval (USPTO 20240290622)
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By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News – From Washington, D.C., NewsRx journali sts report that a patent application by the inventors KANAKAMEDALA, Senaka (San Jose, CA, US); MAKALA, Raghuveer S. (Campbell, CA, US); SHARANGPANI, Rahul (Frem ont, CA, US); TIRUKKONDA, Roshan Jayakhar (Milpitas, CA, US), filed on July 26, 2023, was made available online on August 29, 2024. No assignee for this patent application has been made. News editors obtained the following quote from the background information suppli ed by the inventors: “Three-dimensional vertical NAND strings having one bit per cell are disclosed in an article by T. Endoh et al., titled “Novel Ultra High D ensity Memory With A Stacked-Surrounding Gate Transistor (S-SGT) Structured Cell ”, IEDM Proc. (2001) 33-36.”