Abstract
Reporters obtained the following quote from the background information supplied by the inventors: “The disclosure relates to a laser peening processing device a nd a laser peening processing method. “Laser peening processing is known as a method of reforming the surface of an ob ject by applying residual stress to the surface. The laser peening processing is performed by concentratedly irradiating the surface to be processed of a workpi ece covered with liquid with a laser beam. When the surface to be processed of a workpiece covered with liquid is concentratedly irradiated with a laser beam, i t is possible to confine the plasma generated by the irradiation of the laser be am within the liquid. Consequently, the pressure of a shock wave is applied to t he surface to be processed. In this manner, it is possible to cause compression stress to remain within the workpiece by plastically deforming the surface of th e workpiece.
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