Abstract
From the background information supplied by the inventors, news correspondents o btained the following quote: “Electronic device manufacturing systems typically include process tools having multiple process chambers and one or more load-lock chambers, which may be connected to a transfer chamber. Such process chambers m ay be used to carry out any number of processes on substrates (e.g., silicon-con taining wafers, both patterned and unpatterned, masked wafers, glass plates, sil ica-containing articles, and so forth) such as deposition, oxidation, nitration, etching, polishing, cleaning, lithography, metrology, and so forth.
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