Abstract
The following quote was obtained by the news editors from the background informa tion supplied by the inventors: “In semiconductor processing and other electroni cs processing, platforms are often used that use robotic arms to transport objec ts, such as wafers, between processing chambers, from storage areas (e.g., front opening unified pods (FOUPs)) to processing chambers, from processing chambers to storage areas, and so on. A processing system, such as a wafer processing sys tem, has one or more processing chambers for processing of wafers. A gas may be used to etch a wafer in a processing chamber (e.g., a wafer may be etched while electrostatically clamped in position in an etch chamber). The robotic arms are to pick up objects from specific locations and transport the objects to specific locations.”