首页|Patent Application Titled 'Wafer Transfer Apparatus, Wafer Transfer System, And Method For Removing Particles In Wafer Transfer Apparatus' Published Online (USP TO 20240279003)
Patent Application Titled 'Wafer Transfer Apparatus, Wafer Transfer System, And Method For Removing Particles In Wafer Transfer Apparatus' Published Online (USP TO 20240279003)
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By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News – According to news reporting originatin g from Washington, D.C., by NewsRx journalists, a patent application by the inve ntors CHOI, Jin Hyuk (Suwon-si, KR); CHUN, Hyun Soo (Suwon-si, KR); HWANG, Beom Soo (Suwon-si, KR); JEON, Hyun Joo (Suwon-si, KR); LEE, Kong Woo (Suwon-si, KR); LEE, Kyu Sang (Suwon-si, KR); SONG, Myung Ki (Suwon-si, KR); UH, Ji Ho (Suwon-s i, KR), filed on September 22, 2023, was made available online on August 22, 202 4. No assignee for this patent application has been made. Reporters obtained the following quote from the background information supplied by the inventors: “ “Field “The present disclosure relates to a wafer transfer apparatus, a wafer transfer system, and a method for removing particles in the wafer transfer apparatus. “Description of Related Art
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