首页|'Adhesive Application System' in Patent Application Approval Process(USPTO 2024 0328180)
'Adhesive Application System' in Patent Application Approval Process(USPTO 2024 0328180)
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By a News Reporter-Staff News Editor at Robotics & Machine Learning DailyNews Daily News – A patent application by the inventor P ickering, Samuel Thomas (Kalamunda, AU), filedon July 8, 2021, was made availab le online on October 3, 2024, according to news reporting originatingfrom Washi ngton, D.C., by NewsRx correspondents.This patent application has not been assigned to a company or institution.The following quote was obtained by the news editors from the background informa tion supplied bythe inventors: “The reference in this specification to any prio r publication (or information derived fromit), or to any matter which is known, is not, and should not be taken as an acknowledgment or admissionor any form o f suggestion that the prior publication (or information derived from it) or know n matterforms part of the common general knowledge in the field of endeavour to which this specification relates.“WO 2007/076581 describes an automated brick laying system for constructing a bu ilding from aplurality of bricks comprising a robot provided with a brick layin g and adhesive applying head, a measuringsystem, and a controller that provides control data to the robot to lay the bricks at predetermined locations.The mea suring system measures in real time the position of the head and produces positi on data for thecontroller. The controller produces control data on the basis of a comparison between the position dataand a predetermined or pre-programmed po sition of the head to lay a brick at a predetermined positionfor the building u nder construction. The controller can control the robot to construct the buildin g in acourse by course manner where the bricks are laid sequentially at their r espective predetermined positionsand where a complete course of bricks for the entire building is laid prior to laying of the bricks for thenext course.
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