首页|Researchers Submit Patent Application, 'Injection Molding System', for Approval (USPTO 20240300155)

Researchers Submit Patent Application, 'Injection Molding System', for Approval (USPTO 20240300155)

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By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News – From Washington, D.C., NewsRx journali sts report that a patent application by the inventors ANEGAWA, Kenta (MATSUMOTO- SHI, JP); DING, Yimei (SHIOJIRI-SHI, JP); FUCHII, Masashi (MINOWA-MACHI, JP); II ZUKA, Naoki (SHIOJIRI-SHI, JP); KANAI, Yasuto (MATSUMOTOSHI, JP); MARUYAMA, Hid enobu (AZUMINO-SHI, JP), filed on March 6, 2024, was made available online on Se ptember 12, 2024. No assignee for this patent application has been made. News editors obtained the following quote from the background information suppli ed by the inventors: “ “The present disclosure relates to an injection molding system.

Emerging TechnologiesMachine LearningPatent ApplicationRobotRobotics

2024

Robotics & Machine Learning Daily News

Robotics & Machine Learning Daily News

ISSN:
年,卷(期):2024.(Oct.2)