Abstract
Reporters obtained the following quote from the background information supplied by the inventors: “In the context of manufacturing integrated circuits, wafer di cing is the process by which dies are separated from a wafer of semiconductor fo llowing the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing and other forms of cutting. However, in some instan ces, during the dicing process, chipping can occur on the wafer. That is, the cu tting/removal of wafer material via abrasive force can cause chipping to occur a t the groove edges of the wafer because wafer material is typically brittle.
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