首页|Researchers Submit Patent Application, 'End Effector Pad Design For Bowed Wafers ', for Approval (USPTO 20240335954)
Researchers Submit Patent Application, 'End Effector Pad Design For Bowed Wafers ', for Approval (USPTO 20240335954)
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News editors obtained the following quote from the background information supplied by the inventors: “In semiconductor wafer processing tools, wafer handling robots with end effectors may be used to transfer substrates between different loc ations within a tool, such as processing stations, front-opening universal pods (FOUPs), aligners, load locks, etc. In some types of end effector, when a substr ate is handled by a wafer handling robot, the substrate sits on end effector pad s located on the end effector. The end effector pads may be used to secure the s ubstrate to the wafer handling robot through the use of vacuum and frictional fo rce. If the substrate is not properly secured to the wafer handling robot, the s ubstrate may slip when being transferred. A substrate slipping may create a vari ety of risks such as breaking substrates, crashing substrates, misalignment of s ubstrates in processing stations, and other tool errors.”
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