Abstract
2024 OCT 03 (NewsRx)-By a News Reporter-Staff News Editor at Robotics & Machine Learning Daily News Daily News-A patent application by the inventors HIGASHITARUMIZU, Daisuke (Fukuoka, JP); KANG, Yonggu (Gyeonggi-do, KR); MINAMI, Takashi (Fukuoka, JP); RYU, Mid Uem (Gyeonggi-do, KR);SANEMASA, Hiroki (Fukuoka , JP); YUN, Jung-ho (Gyeonggi-do, KR), filed on May 22, 2024, was made available online on September 19, 2024, according to news reporting originating from Wash ington, D.C., by NewsRx correspondents. This patent application has not been assigned to a company or institution. The following quote was obtained by the news editors from the background informa tion supplied by the inventors: "Semiconductor devices are manufactured by a num ber of processes such as a thin film deposition process, an ion implantation pro cess, a diffusion process, a cleaning process, a photolithography process, and a n etching process. As for an apparatus where such semiconductor manufacturing pr ocesses are carried out, a single-wafer processing apparatus is being widely use d to process wafers one by one.
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