This patent was filed on April 29, 2022 and was published online on November 5, 2024.From the background information supplied by the inventors, news correspondents o btained the followingquote:“Field“Embodiments of the present disclosure generally relate to a method and software for product inspection.Specifically, embodiments of the present disclosure rel ate to a defect detection system and methodsuitable for detecting defects on an edge of a wafer.
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Applied Materials Inc./Business/Emergi ng Technologies/Machine Learning/Robot/Robotics/Technology Companies
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