首页|Researchers Submit Patent Application, 'Dummy Die Material Selection And Positio ning For Bonding Processes', for Approval (USPTO 20240363445)
Researchers Submit Patent Application, 'Dummy Die Material Selection And Positio ning For Bonding Processes', for Approval (USPTO 20240363445)
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News editors obtained the following quote from the background information suppli ed by the inventors:“In order to form processing circuits or logic circuits and similar integrated chip structures, individual diesare singulated and bonded t o bonding wafers. The bonding wafers may then undergo further processingsuch as gapfill processes which require subsequent planarization and the like. The inve ntor has observedthat the subsequent processes are often substantially impacted by the die height, die placement, and diedensity on the bonding wafer, both at wafer center and wafer edge.
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