National Tsing Hua University Researcher Highlights Research in Machine Learning (Combining polynomial regression with unsupervised machine learning on wafer-le vel packaging reliability prediction)
National Tsing Hua University Researcher Highlights Research in Machine Learning (Combining polynomial regression with unsupervised machine learning on wafer-le vel packaging reliability prediction)
By a News Reporter-Staff News Editor at Robotics & Machine Learning DailyNews - Current study results on artificial intelligence have been published. According to news reportingout of National Tsing Hua Unive rsity by NewsRx editors, research stated, “ABSTRACT: The benefits ofwafer-level packaging include better thermal dissipation, lower latency and reduced space c onsumption.”Financial supporters for this research include Src; National Tsing Hua Universit y.
Key words
National Tsing Hua University/Cyborgs/Emerging Technologies/Machine Learning/Mathematics/Polynomial
NETL
NSTL