Robotics & Machine Learning Daily News2024,Issue(Dec.6) :180-182.

'Substrate Processing System And Film Thickness Measuring Method' in Patent Appl ication Approval Process (USPTO 20240387301)

专利申请批准程序(USPTO 20240387301)中的“基板处理系统和膜厚测量方法”

Robotics & Machine Learning Daily News2024,Issue(Dec.6) :180-182.

'Substrate Processing System And Film Thickness Measuring Method' in Patent Appl ication Approval Process (USPTO 20240387301)

专利申请批准程序(USPTO 20240387301)中的“基板处理系统和膜厚测量方法”

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摘要

由一名新闻记者-机器人与机器学习日报的工作人员新闻编辑每日新闻-发明者KYOKANE,Hirokazu(Yamanashi,JP);TANAKA,Satoshi(Yamanashi,JP)于2024年2月1日提交,于2024年11月21日在线提供,根据NewsRx记者从华盛顿特区发回的新闻报道。

Abstract

By a News Reporter-Staff News Editor at Robotics & Machine Learning DailyNews Daily News - A patent application by the inventors KYOKANE, Hirokazu (Yamanashi, JP); TANAKA,Satoshi (Yamanashi, JP), filed on Feb ruary 1, 2024, was made available online on November 21, 2024,according to news reporting originating from Washington, D.C., by NewsRx correspondents.

Key words

Cyborgs/Emerging Technologies/Machine Learning/Patent Application/Robot/Robotics

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出版年

2024
Robotics & Machine Learning Daily News

Robotics & Machine Learning Daily News

ISSN:
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