首页|Patent Issued for Wafer processing tools and methods thereof (USPTO 12142513)
Patent Issued for Wafer processing tools and methods thereof (USPTO 12142513)
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News editors obtained the following quote from the background information suppli ed by the inventors:“Wafer processing tools, such as chemical mechanical polish ing (CMP) systems, may encounter delayscaused by the transfer of wafers between different processing stations. For example, processing may bedelayed as robots wait to access wafers before and/or after different processes.”As a supplement to the background information on this patent, NewsRx corresponde nts also obtainedthe inventors’ summary information for this patent: “In a firs t aspect, a wafer processing device is provided.The wafer processing device may include a wafer exchanger including two or more blades, each of the twoor more blades configured to receive a wafer, the two or more blades rotatable about an axis on a singlehorizontal plane, and the two or more blades movable between a t least a load cup and a robot accesslocation; wherein the load cup includes a wafer station that is vertically moveable relative a blade locatedin the load c up and is configured to remove a wafer from a blade located in the load cup and place awafer on a blade located in the load cup.
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