摘要
新闻编辑从发明人提供的背景信息中获得了以下引文：“晶圆加工工具，如化学机械抛光(CMP)系统，可能会遇到延迟”由晶圆在不同加工站之间转移所引起。例如，处理可以是由于机器人等待在不同工艺之前和/或之后访问晶圆而延迟。作为本专利背景资料的补充，NewsRx通信也获得了发明人对该专利的总结信息：“首先，提供一种晶片处理装置。”晶片处理装置可包括晶片交换器，该晶片交换器包括两个或更多个叶片，每个叶片都具有两个或更多个叶片，或多个刀片，所述刀片配置成接收晶片，所述两个或多个刀片可绕单个刀片上的轴线旋转水平面，以及两个或多个刀片可在负载杯和机器人通道之间移动位置；其中所述负载杯包括晶圆台，所述晶圆台相对于位于所述位置的刀片垂直移动在负载C中向上并被配置为从位于负载杯中的刀片中移除晶片并放置一个位于载料杯中的刀片上的晶片。
Abstract
News editors obtained the following quote from the background information suppli ed by the inventors:“Wafer processing tools, such as chemical mechanical polish ing (CMP) systems, may encounter delayscaused by the transfer of wafers between different processing stations. For example, processing may bedelayed as robots wait to access wafers before and/or after different processes.”As a supplement to the background information on this patent, NewsRx corresponde nts also obtainedthe inventors’ summary information for this patent: “In a firs t aspect, a wafer processing device is provided.The wafer processing device may include a wafer exchanger including two or more blades, each of the twoor more blades configured to receive a wafer, the two or more blades rotatable about an axis on a singlehorizontal plane, and the two or more blades movable between a t least a load cup and a robot accesslocation; wherein the load cup includes a wafer station that is vertically moveable relative a blade locatedin the load c up and is configured to remove a wafer from a blade located in the load cup and place awafer on a blade located in the load cup.
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