首页|Multiscale Profile Characterization Based on Atomic Force Microscopy

Multiscale Profile Characterization Based on Atomic Force Microscopy

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The accurate cross-scale measurement of surface profiles is essential in various fields, such as materials science and nanotechnology. Traditional measurement techniques, such as atomic force microscopy (AFM), provide high-resolution data but are limited in range, making it challenging to characterize surfaces with both fine and large-scale features comprehensively. This limitation creates a conflict in achieving precise, wide-range measurements necessary for advanced applications. To address this challenge, we propose a novel nested-feedback splicing measurement strategy that integrates AFM with an electrodynamic displacement system. This approach combines the high resolution of AFM with the extensive range capabilities of electrodynamic stages, allowing for detailed characterization across multiple scales. Our results demonstrate that the developed system significantly improves measurement accuracy, particularly in capturing detailed surface profiles over large areas. The experimental data validate the effectiveness of the proposed method, showing enhanced precision in multiscale topographic characterization and seamless integration between fine and large-scale measurements. This advancement paves the way for more comprehensive surface analyses in scientific research and industrial applications, highlighting the system’s potential to revolutionize precision measurement technology.

VectorsSplicingSurface topographyCalibrationAccuracyMotion measurementAtomic measurementsSurface morphologyRobotsMeasurement uncertainty

Kaixuan Wang、Dingyi Wang、Jian Sun、Jialin Shi、Peng Yu、Chanmin Su、Lianqing Liu

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State Key Laboratory of Robotics, Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang, China|Institutes for Robotics and Intelligent Manufacturing, Chinese Academy of Sciences, Shenyang, China|Shenyang Institute of Automation, University of Chinese Academy of Sciences, Beijing, China

Innovation Institute, Intelligent Robotics Shenyang Company Ltd., Shenyang, China

State Key Laboratory of Robotics, Shenyang Institute of Automation, Chinese Academy of Sciences, Shenyang, China|Institutes for Robotics and Intelligent Manufacturing, Chinese Academy of Sciences, Shenyang, China

2025

IEEE transactions on instrumentation and measurement

IEEE transactions on instrumentation and measurement

SCI
ISSN:
年,卷(期):2025.74(1)
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