首页|Enhanced electromagnetic wave absorption and thermal conductivity in epoxy composites with a heterostructure-rich 3D M0S2/CMF network framework

Enhanced electromagnetic wave absorption and thermal conductivity in epoxy composites with a heterostructure-rich 3D M0S2/CMF network framework

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  • NETL
  • NSTL
  • Elsevier
With the widespread application of highly integrated and high-frequency power devices in the electronics field, traditional electronic packaging materials can no longer effectively resist the harm caused by electromagnetic interference and heat accumulation to electronic equipment. To address these challenges, we have successfully constructed a heterostructure-rich dual-level three-dimensional (3D) network framework (M0S2/CMF) by effectively integrating molybdenum disulftde (M0S2) with carbonized melamine foam (CMF). These fillers were then composited with epoxy resin (EP) to develop M0S2/CMF/EP composites exhibiting both electromagnetic wave absorption (EMA) and enhanced thermal conductivity. Specifically, two-dimensional (2D) M0S2 nanosheets with a lT/2H-phase structure uniformly grew on the surface of CMF, improving the poor impedance characteristics of the 3D carbon structure and increasing heterointerfaces and multiple scattering abilities. Owing to the synergistic effects of attenuation performance and impedance matching, the EP-based M0S2/CMF-I composite demonstrated an impressive reflection loss value of -64.80 dB and an effective absorption bandwidth of 8.48 GHz, achieved with only a 5 wt% loading. Correspondingly, CST simulation results indicated that when electromagnetic waves are vertically incident on M0S2/CMF-I/EP samples, the radar cross-section (RCS) attenuation value can reach up to 35.4 dBm2. Moreover, the highly interconnected 3D carbon structure of CMF provides broad pathways for phonon transport, resulting in the thermal conductivity of MoS_2/CMF-l/EP reaching 0.41 W/mK at room temperature, a nearly 141 % improvement compared to pure EP. This multifunctional EP-based composite, with its high-efficiency EMA and thermal management performance, shows great potential for application in the packaging of highly integrated electronic devices.

Molybdenum disulfideCarbonized melamine foamMicrowave absorptionThermal managementElectronic devices packaging

Haoran Geng、Long Zhao、Jing Deng、Jingru Chen、Yihao Fan、Qingyun Zhao、Hongxing Gui、Jianhe Liao、Yanfang Zhao、Yongxin Qian、Guizhen Wang

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School of Materials Science and Engineering, Hainan University, Haikou, 570208, China||Rubber Research Institute, Chinese Academy of Tropical Agricultural Sciences, Haikou, 570100, China

School of Materials Science and Engineering, Hainan University, Haikou, 570208, China

Rubber Research Institute, Chinese Academy of Tropical Agricultural Sciences, Haikou, 570100, China

2025

10.1016/j.compscitech.2024.110993

Composites science and technology

Composites science and technology

SCI
ISSN：0266-3538
年,卷(期)：2025.261(Mar.1)
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