首页|Low temperature bonding for 3D integration 2024
Low temperature bonding for 3D integration 2024
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NETL
NSTL
We are pleased to present a special issue on Low Temperature Bonding for 3D Integration (LTB- 3D) 2024 of the Japanese Journal of Applied Physics (JJAP). Low temperature bonding is one of the key technologies for electronics device 3D integration as high-performance computing, photonics, power electronics, MEMS, and so on. This special issue is a collection of papers in the field of low temperature bonding, including its science, metrology, and application, as above, based on the presentations at the 2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2024). The scope of this special issue is listed below.
NETL
NSTL
