首页|Researchers Submit Patent Application, 'Serving Large Language Models with 3D-DR AM Chiplets', for Approval (USPTO 20240403254)
Researchers Submit Patent Application, 'Serving Large Language Models with 3D-DR AM Chiplets', for Approval (USPTO 20240403254)
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No assignee for this patent application has been made.News editors obtained the following quote from the background information suppli ed by the inventors:“High performance computing can be performed using computin g packages that have a plurality ofhigh bandwidth memory (“HBM”) dies. However, these packages have been configured to operate forapplications that involve hi gh arithmetic intensity through the use of a high-power computing die. However,the high arithmetic intensity and high-power design of curren
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