首页|Patent Issued for Process kit enclosure system (USPTO 12165905)
Patent Issued for Process kit enclosure system (USPTO 12165905)
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Reporters obtained the following quote from the background information supplied by the inventors: “Insemiconductor processing and other electronics processing, platforms are often used that use robotic armsto transport objects such as waf ers between processing chambers, from storage areas (e.g., front openingunified pods (FOUPs)) to processing chambers, from processing chambers to storage areas , and so on. Aprocessing system, such as a wafer processing system, has one or more processing chambers for processingof substrates. A gas may be used to etch a substrate in a processing chamber (e.g., a substrate may beetched while elec trostatically clamped in position in an etch chamber). One or more process kit r ingsmay surround a substrate (e.g., to protect one or more portions of the proc essing chamber, the substrate,etc.). For example, a circular part, referred to as an edge ring or process kit ring, is positioned immediatelyoutside of the ou ter diameter of the substrate to protect the upper surface of a chuck (e.g., an electrostaticchuck) supporting the substrate from being etched by etchant chemi stry. Process kit rings are made fromseveral different materials and can have d ifferent shapes, both which affect process uniformity near theprocess kit ring. During processing, process kit rings are etched over time and result in shape c hanges aswell as changes in processing uniformity.
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