Abstract
No assignee for this patent application has been made.News editors obtained the following quote from the background information suppli ed by the inventors:“Thermal management of processors, memory, and other heat-g enerating components of high-performancecomputing devices removes relatively la rge quantities of heat from a smaller area or volume. Conventionalthermal manag ement systems connect a working fluid to the heat-generating components through ametallic heat sink or other interface. Reducing the number of thermal interfac es can improve thermalmanagement performance.”
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