首页|Researchers Submit Patent Application, 'Microfluidics Thermal Management Flow Pa tterns And Schemas', for Approval (USPTO 20240403522)
Researchers Submit Patent Application, 'Microfluidics Thermal Management Flow Pa tterns And Schemas', for Approval (USPTO 20240403522)
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No assignee for this patent application has been made.News editors obtained the following quote from the background information suppli ed by the inventors:“Thermal management of processors, memory, and other heat-g enerating components of high-performancecomputing devices removes relatively la rge quantities of heat from a smaller area or volume. Conventionalthermal manag ement systems connect a working fluid to the heat-generating components through ametallic heat sink or other interface. Reducing the number of thermal interfac es can improve thermalmanagement performance.”
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